What is the difference between via and pad in PCB
First, the difference between via and pad 1, via Via is called a via, and has a through hole, a blind hole and a buried hole. It is mainly used for the connection of wires of different layers in the...
Analysis and Comparison of Heat Dissipation Difference between Ceramic Heat Dissipation Substrate and MCPCB
With the rapid development of science and technology, the awareness of global environmental protection has risen in recent years. How to effectively develop energy-saving and energy-saving technology...
How to do PCB layer design to make PCB's EMC effect optimal?
In the EMC design considerations of the PCB, the first is the setting of layers; the number of layers of a single board is composed of the power source, the number of ground layers, and the number of...
LED COB type: MCPCB (metal substrate) and ceramic substrate comparison
COB : The Chip On Board (COB) process first covers the wafer placement point with a thermally conductive epoxy resin (usually an epoxy resin doped with silver particles) on the surface of the...
